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Comparison Between the Piezoelectric Method and Ultrasonic Signal Analysis for Crack Selection in Type II Multilayer Ceramic Capacitors
Ousten, Y.; Mejdi, S.; Bechou, L.; Tregon, B.; Danto, Y. - In: Quality and reliability engineering international 14 (1998) 2, pp. 91-94
Persistent link: https://www.econbiz.de/10006393181
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Long-term Reliability Prediction of 935 nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests
Deshayes, Y.; Bechou, L.; Verdier, F.; Danto, Y. - In: Quality and reliability engineering international 21 (2005) 6, pp. 571-594
Persistent link: https://www.econbiz.de/10006361602
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Comparison of Conventional and Pseudomorphic HEMTs Performances by Drain Current Transient Spectroscopy and L. F. Channel Noise
Saysset, N.; Labat, N.; Touboul, A.; Danto, Y.; Dumas, J.M. - In: Quality and reliability engineering international 12 (1996) 4, pp. 309-316
Persistent link: https://www.econbiz.de/10006403119
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Early Detection of Ageing in Solder Joints through Laser Probe Thermal Analysis of the Peltier Effect
Claeys, W.; Quintard, V.; Dilhaire, S.; Lewis, D.; Danto, Y. - In: Quality and reliability engineering international 10 (1994) 4, pp. 289-296
Persistent link: https://www.econbiz.de/10006408725
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Testing of the Quality of Solder Joints through the Analysis of their Thermal Behaviour with an Interferometric Laser Probe
Claeys, W.; Quintard, V.; Dilhaire, S.; Lewis, D.; Danto, Y. - In: Quality and reliability engineering international 10 (1994) 3, pp. 237-242
Persistent link: https://www.econbiz.de/10006408735
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Localization and Characterization of Latch-up Sensitive Areas using a Laser Beam: Influence on Design Rules of ICs in CMOS Technology
Fouillat, P.; Danto, Y.; Dom, J.P. - In: Quality and reliability engineering international 9 (1993) 6, pp. 477-482
Persistent link: https://www.econbiz.de/10006413390
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Thermoreflectance Optical Test Probe for the Measurement of Current-induced Temperature Changes in Microelectronic Components
Claeys, W.; Dilhaire, S.; Quintard, V.; Dom, J.P.; Danto, Y. - In: Quality and reliability engineering international 9 (1993) 4, pp. 303-308
Persistent link: https://www.econbiz.de/10006413427