Narrow search
Showing 1 - 5 of 5
Cover Image
In Situ Failure Detection in Thick Film Multilayer Systems
Manca, J.; Schepper, L.De; Ceuninck, W.De; D'Olieslaeger, M. - In: Quality and reliability engineering international 11 (1995) 4, pp. 307-312
Persistent link: https://www.econbiz.de/10006404874
Cover Image
Bimodal Failure Behaviour of Metal Film Resistors
Croes, K.; Ceuninck, W.De; Schepper, L.De; Tielemans, L. - In: Quality and reliability engineering international 14 (1998) 2, pp. 87-90
Persistent link: https://www.econbiz.de/10006393182
Cover Image
Evaluation on a Two-day Time Scale of High-reliability Electronic Assemblies by In-situ Electrical and Opto-mechanical Test Techniques
Gregoris, G.; Bouton, F.; Keukeleire, C.De; Siliprandi, P. - In: Quality and reliability engineering international 12 (1996) 4, pp. 247-252
Persistent link: https://www.econbiz.de/10006403129
Cover Image
Accelerated Ageing with in situ Electrical Testing: a Powerful Tool for the Building-in Approach to Quality and Reliability in Electronics
Schepper, L.De; Ceuninck, W.De; Lekens, G.; Stals, L.; … - In: Quality and reliability engineering international 10 (1994) 1, pp. 15-26
Persistent link: https://www.econbiz.de/10006408771
Cover Image
Electrical Characterization and Reliability Evaluations of Capacitors by means of In Situ Leakage Current Measurements
Manca, J.V.; Croes, K.; Schepper, L.De; Cueninck, W.De; … - In: Quality and reliability engineering international 14 (1998) 2, pp. 63-68
Persistent link: https://www.econbiz.de/10006393187